Reflow soldering is the modern mechanism for assembling most printed circuit boards today. Reflow allows the components to be separated to be placed during the actual welding process, resulting in very fast mass production. Reflow welding is whether it is used

Motherboard failure is often manifested as the system startup failure, the screen is not displayed, sometimes can start and sometimes can not start and other difficult to intuitively judge the fault phenomenon. In the motherboard fault inspection and maintenance, it is generally used

General circuit boards are in accordance with the number of layers and thickness of conductive copper foil to divide the layers, they can be divided into single-layer board, double-layer board, multi-layer board and double panel, their structure is also different, the following to introduce their different properties where