Reflow soldering is the modern mechanism for assembling most printed circuit boards today. Reflow allows the components to be separated to be placed during the actual welding process, resulting in very fast mass production. Reflow soldering is the most widely used method of welding used inside PCB assemblies whether it is for mass production or prototype PCB assembly for surface mount components.

In reflow soldering, the pad of the printed circuit board is first covered with solder paste, which is a mixture of pure solder, small spheres and microbeads of flux. This mixture is called solder paste.

Solder paste is applied in the form of a pattern using a template so that it leaves solder paste only where the terminal of the device needs to be welded. Now, the solder paste is sticky, so the device can be placed on the solder paste and held there by simply sticking together.

1. After all the components have been installed on the printed circuit board, the circuit board is placed in the reflow machine equipment, where it is raised to a temperature higher than the melting point of the solder.

2. The solder then flows back to the terminals of the device, and the circuit board is allowed to cool.

3, at this point, all the devices have been connected at the same time, and the SMT chip circuit board is fully assembled.

Now that this is done, the process is a little different from manual welding by people. When you're welding by hand, you're working one component at a time, heating each component at a time, so the technique is a little bit different. And because our soldering iron and reflow furnace are a very different tool, it is an alternative technology;

Now, the circuit board can be put into an oven, such as an oven, and raised to the appropriate temperature to melt the solder. Doing so allows for the same professional quality as a machine-made circuit board.