SMT processing refers to SMT patches, refers to surface mount technology, is suitable for SMT production of electronic components affixed to PCB (printed circuit board), after a certain process into a point of electronic components circuit board technology.
SMT is Surface assembly Technology (Surface Mounted Technology) (short for Surface Mounted technology), is a popular technology and process in the electronic assembly industry. Electronic circuit Surface Mount Technology (SMT), known as surface mount or surface mount technology.
It is a kind of pin-free or short-lead surface assembly components (SMC/SMD, Chinese called chip components) installed on the surface of the Printed Circuit Board (PCB) or other substrate surface, by reflow welding or dip welding and other methods to weld the circuit assembly technology.
The selection and design of surface mounted components is a key part of the overall design of the product, the designer determines the electrical performance and function of the components in the system structure and detailed circuit design stage, and the packaging form and structure of the surface assembled components should be determined in the SMT design stage according to the specific conditions of the equipment and process and the overall design requirements.
The solder joint installed on the surface of the patch processing is both a mechanical connection point and an electrical connection point, and a reasonable choice has a decisive impact on improving the PCB design density, productivity, testability and reliability.
Surface-mounted components are functionally indistinguishable from plug-in components; the difference lies in the packaging of the components. Surface-mounted packages must have a matching coefficient of thermal expansion for components and substrates that are resistant to high temperatures when welded. These factors must be taken into account in the product design.